JPS6214698Y2 - - Google Patents
Info
- Publication number
- JPS6214698Y2 JPS6214698Y2 JP1558481U JP1558481U JPS6214698Y2 JP S6214698 Y2 JPS6214698 Y2 JP S6214698Y2 JP 1558481 U JP1558481 U JP 1558481U JP 1558481 U JP1558481 U JP 1558481U JP S6214698 Y2 JPS6214698 Y2 JP S6214698Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor element
- circuit board
- mold
- mold release
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 7
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1558481U JPS6214698Y2 (en]) | 1981-02-06 | 1981-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1558481U JPS6214698Y2 (en]) | 1981-02-06 | 1981-02-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57130436U JPS57130436U (en]) | 1982-08-14 |
| JPS6214698Y2 true JPS6214698Y2 (en]) | 1987-04-15 |
Family
ID=29813577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1558481U Expired JPS6214698Y2 (en]) | 1981-02-06 | 1981-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6214698Y2 (en]) |
-
1981
- 1981-02-06 JP JP1558481U patent/JPS6214698Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57130436U (en]) | 1982-08-14 |
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